Hybrionic Pte Ltd
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Products
- Multi-layer Thick-Film circuit (Using high precious metals like platinum, palladium, Ruthenium, Gold and Silver)
- Gold & Aluminum wire bonding hybrid packages
- Chip-on-Board (COB)
- Chip Scale Packages (CSP)
- Printed Circuit Board Assembly - SMT and Through Hole (PCBA)
- Custom hybrid packages for CCTV camera and Infra Red sensors
- Flex circuit assembly
- More
